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Some Worry That Success of Apple Is Tied to Japan
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SAN FRANCISCO — Last week, shares of Apple did something they rarely do: they fell nearly 7 percent, in two days.
The unusually sharp drop, which was twice as large as the decline in technology shares over all, was driven in part by worries over the impact that the crisis in Japan would have on Apple’s ability to make its blockbuster products. It didn’t help that the iPad 2, the latest Apple gadget that everyone seems to want to get their hands on, appears to be in increasingly short supply, a situation Apple has found itself in before.
The two factors are unrelated, at least for now. Any problems affecting Apple’s supply chain in Japan will not affect finished products for weeks, analysts say. But some investors fear that Apple’s challenges in meeting demand for a product like the iPad 2 will simply get worse in the months to come as some critical components are delayed.
Many companies would be happy to have Apple’s problem of high demand for their products. And on Monday, Apple’s shares bounced back, gaining more than 2.5 percent; on Tuesday, they gained another 0.56 percent.
But Apple, like other technology companies, is at risk of being buffeted by the unfolding crisis in Japan. Every major computer and consumer electronics maker relies on components that directly or indirectly come from Japan. Apple’s success, though, combined with its recurring difficulties in meeting the demand for some its hottest products, including the iPad and iPhone, have prompted investors to single out the company.
“Fear is affecting Apple in particular,” said Gene Munster, an analyst with Piper Jaffray. “This is a company with tight supplies, and the fear is that they will get even tighter.”
Figuring out the precise impact on Apple of the disruptions in Japan is more art than science. The company, which declined to comment for this article, is intensely secretive about its supply chain. While other companies typically don’t talk about whom they buy parts from, analysts say Apple takes secrecy particularly seriously and will cut off any supplier that it suspects of being loose-lipped.
That has left analysts piecing together bits of information dribbling out of Japan about certain parts or suppliers. In a series of sometimes-conflicting reports, they have focused on a handful of iPad components.
On Monday, for example, analysts highlighted a new concern: 300-millimeter wafers, which are silicon disks used to manufacture essential chips for the iPhone and iPad. A factory operated by Shin-Etsu in Shirakawa, in northern Japan, produces at least 15 percent of the world’s supply of the wafers, said Gus Richard, an analyst with Piper Jaffray, and is not likely to become operational for a long time.
“Will it affect Apple today or tomorrow?” Mr. Richard said. “No. But everyone is worried about those wafers. At some point, chip makers will run out.”
Last week, the focus was elsewhere. On Thursday, IHS iSuppli, which is known for its “teardowns” of new Apple products — taking them apart as soon as they come out to analyze their components — identified five parts that it said could be affected. They included the flash storage, memory chips, an electronic compass, batteries and glass used in the touch screen.
Underscoring the challenges with its analysis, iSuppli said that the glass was only likely to come from Japan, and that it might have failed to identify other Japanese components in the device.
Other analysts said last week that they were concerned about the supply of BT resin, a product used to produce circuit boards for iPhone and iPad chips, manufactured primarily by a Mitsubishi facility in Japan that was temporarily shut down.
“Part of it is a guessing game,” said Andy Hargreaves, an analyst with Pacific Crest Securities. Mr. Hargreaves was among those who played down the impact of the crisis on Apple. Mr. Hargreaves noted that Apple would be first in line to receive components like flash storage and memory chips. He also noted that the prices of those components, while likely to rise, were still lower than in 2010.
Like many others, though, Mr. Hargreaves was cautious. “The biggest thing we don’t know is how long will the disruptions last,” he said.
With supplies for the iPad 2 and the iPhone tight, even a short-lived disruption could have an effect. Apple has not said how many of the new iPads it has sold since it went on sale on March 11. Analysts estimated that the number was around 500,000 in the first weekend. After that, sales slowed to a trickle, even as demand remained strong.
Apple stores have been resupplied daily, but in small amounts. Mr. Munster said a large group of people lined up overnight at the Apple store in New York’s meatpacking district one day last week. Only the first 20 people were able to buy an iPad. Another Apple store, at the Mall of America in Minneapolis, received just six iPads on a recent day, while a Target store received 15, he said.
On Apple’s own Web site, the waiting time for new orders has increased to four to five weeks, from two to three weeks. On Friday, the company plans to begin selling the iPad 2 in some two dozen countries. While Apple is certain to have earmarked units for the international debut, no one outside of the company knows how many. Analysts said they were unsure whether serving a bigger market would worsen supply problems.
Apple has faced challenges in meeting demand as far back as 2004, when it first released the iPod Mini. The iPhone has been in tight supply since Apple introduced it in 2007. And only in the most recent quarter, Apple managed to end the backlog for the original iPad.
“This is a problem that Apple has had since 2004,” Mr. Munster said. “They are doing a better job than before, but they still can’t make enough.”
Mr. Munster predicted that the delay for online orders of the iPad 2 would extend to six or seven weeks by summer.

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Japanese Earthquake’s Impact on the Automotive Infotainment Industry
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The earthquake and subsequent tsunami have impacted the entire automotive industry supply chain in Japan, including the infotainment segment. This will have worldwide repercussions for the car electronics and infotainment businesses.
Japan in 2010 accounted for 35 percent of the $31.5 billion worldwide automotive infotainment electronics market. The country produced $11 billion worth of infotainment electronics during the year.
Japanese manufacturers in 2010 were responsible for 32 percent of the $22.9 billion worldwide market for automotive semiconductors. The country’s automotive chip production amounted to $7.3 billion in 2010.
Key automotive components produced in the affected area of Japan include semiconductors, liquid crystal displays (LCD) and optical sensors.
Chip suppliers are expected to encounter difficulties in obtaining and distributing raw materials and in shipping out products. This is likely to cause some disruption in automotive semiconductor supplies from Japan during the following weeks, if not months, particularly if suppliers rely on single-sourced solutions.
Northeastern Japan, the worst-hit area following the magnitude 9.0 earthquake and subsequent tsunami, is also home to many semiconductor wafer fabrication facilities. Renesas Electronics, Texas Instruments, Freescale Semiconductor and Fujitsu all are important suppliers to the auto industry and have been affected.
Tier 1 automotive infotainment electronics suppliers operating in Japan have reported varying impacts of the earthquake. However, many of these companies also have manufacturing operations in other locations such as Mexico, so the total impact of the production disruption on output is unclear.
Production facilities that depend upon a steady supply of components—especially microelectronics devices—will experience material and/or component shortages of varying degrees. As mentioned above, single source products will have a greater impact than those that rely on multiple sources. 
A number of sources said that in many cases inventory can make up for immediate component needs and that most suppliers have a good understanding of how long it will take before they run out of parts. At this point, suppliers also are considering alternative supply sources, but this is not an option in some cases.
The global electronics business has been affected on a large scale and also will have an impact on the automotive industry worldwide in some shape or form and, therefore, could affect non-Japanese car original equipment manufacturers (OEM) as well.
The lengthy process of rebuilding or replacing the power generated by the nuclear reactors could complicate industrial output for months. Japan's automakers have stopped auto production at several plants to conserve the region's power. There has been a 10 percent reduction in electrical capacity, which will have some impact on the country’s capability to make products of any type.
For non-Japanese automotive OEMs, the impact of the earthquake on their supply chains could be delayed, as Tier 1 manufacturers assess their supplier situations. BMW, VW, Continental and Bosch all have removed their expatriate employees from Japan. This has an effect on productivity in Japan, and some ongoing programs are likely to be seriously interrupted—if not canceled altogether.


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改善病患生活品質需要更多新科技協助
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醫療電子專家:改善病患生活品質需要更多新科技協助
上網時間:2011年02月23日
2011年度國際固態電路會議(International Solid State Circuits Conference,ISSCC)於美國時間2月20日在舊金山登場;在開幕演說中,與會專家表示,電子技術將協助推動醫療照護體系由醫院擴大至居家,降低相關成本並提升民眾生活品質,但要達到這樣的轉變需要新一代處理器、無線技術、電池技術與資料採集技術的結合。
醫療電子大廠美敦力(Medtronic)技術院士暨神經調控業務(Neuromodulation)工程總監Tim Denison,在ISSCC專題演說會場對台下近3,000位工程師聽眾表示:「目前醫療照護體系正進行一場以連網裝置為基礎的革命,而這需要眾多廠商的共同合作,包括今日在座的各位。」
他在演說中描述了一種尺寸只有阿斯匹靈膠囊大小、卻能監控並分析各種疾病的無線植入裝置,以及可能為大眾生活帶來的改變;此技術是根植於Medtronic等廠商所開發的各類心律調整器(cardiac pacemaker)。他並舉出一系列目前或未來的植入裝置可以治療的症狀。
在另一場專題演說中,歐洲研究機構IMEC的資深副總裁Jo de Boeck則是介紹一種穿戴式的、可監測多種症狀的貼片(patch):「我們正試圖將醫療照護體系由醫院擴大至居家,並期望因此降低民眾就醫成本、改善病患的生活品質。」
兩位講者都認為,如何進一步分析那些藉由未來的植入裝置或是貼片所收集的即時資料流,將會是一大挑戰。「我們必須思考該如何將那些原始數據轉化成有意義的臨床診斷。」Denison表示。
de Boeck則指出,未來的醫療感測裝置將可監測患者的飲食、藥物攝取、睡眠、活動、步伐甚至是呼出的氣體:「以工程的角度來看,那些是大量的訊息(information),還不完全是資料(data)。」
為了啟動這類裝置,電子工程師們也需要開發新的電池或能量採集技術;de Boeck表示,一個在兩年前需要消耗1瓦(watt)功率的無線貼片,若採用今日的最新零組件,耗電量可能僅需100毫瓦(milliwatts,千分之一瓦),但若要適用於6mm見方的印刷電池,該耗電量數字還需要降低到至少50毫瓦。
此外de Boeck認為,工程師也需要開發出新一代的低功耗技術,才能因應感測裝置所收集的大量資料分析,以及越來越複雜的演算法;他呼籲業界針對醫療感測裝置等一列新應用,開發新一代的超低功耗指令集架構。
要催生新一代的醫療科技裝置,還需要封裝技術的加持;Denison舉例指出,在只有膠囊大小的植入裝置中,就需要用到晶圓級(wafer-scale)封裝技術來做出3D堆疊的晶片或是電池元件。
IMEC已經開發出一種採用軟性導線的電極零件,好讓醫療用貼片在使用者活動時跟著伸展;該機構也正在研發將感測器與衣物纖維整合的技術。IMEC在今年度的ISSCC發表了一篇採用有機塑膠基板的8位元處理器技術論文,de Boeck表示:「我們預見在20年內,採用塑膠與矽材料的IC設計工程師會各佔一半。」
Denison表示,醫療電子工程師也能利用目前的消費性電子技術;例如有一家公司所開發的、已核准在歐洲上市的脊髓刺激植入裝置(spinal stimulation implant),就內建三軸加速度計以隨著病患改變姿勢自動切換刺激電流的幅度。
「任天堂(Nintendo)的 Wii 遊戲與蘋果(Apple)的 iPhone 手機已經有可用的技術,因此我們可以把它們結合在醫療植入裝置中。」Denison表示,新一代的植入裝置是可以救命的,例如心室壓力的變化是心臟衰弱的訊號,或是在幾天前對心臟病發提出預警。
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Intel bares technical details of Sandy Bridge
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Intel bares technical details of Sandy Bridge
Posted:25 Feb 2011

Intel Corp. has used the International Solid-State Circuits Conference (ISSCC) to reveal further technical details of its 32nm Sandy Bridge processor. In a presentation made on February 22, the company thoroughly described the processor's modular ring interconnect, the design techniques used to minimize the cache's operational voltage and the inclusion of a debug bus for monitoring traffic on the interconnect.
The 32nm Sandy Bridge processor integrates up to four x86 cores, an optimized GPU, and DDR3 memory and PCI Express controllers on the same die, according to the paper presented at ISSCC by Ernest Knoll, a designer at Intel's design center in Haifa, Israel. Sandy Bridge features 1.16 billion transistors and a die size of 216sq mm, Knoll said.
 

The Sandy Bridge IA core implements several improvements that boost performance without increasing power consumption, including an improved branch prediction algorithm, a micro-operation cache and a floating point advanced vector extension, according to the paper. The devices' CPUs and GPU also share the same 8MB level-3 cache memory, as stated in the paper.
Although the L3 cache units are organized in four slices along with the x86 cores, 2MB per core, they are fully shared with the GPU, Knoll added.
Sandy Bridge's ring interconnect fabric connects all the elements of the chip, including the CPUs, the GPU, the L3 cache and the system agent. Because the ring interconnect is modular, the four-core die can easily be converted into a two-core die by "chopping" out two cores and two L3 cache modules, according to Knoll's presentation. The initial version of Sandy Bridge is available in two- or four-core variations.
"By simply 'chopping' two slices, we get to another level of die," Knoll said.
Intel provided the first details about the Sandy Bridge family of heterogeneous processors at the Intel Developer Forum last September. Intel introduced the first Sandy Bridge products, the second generation of the company's Core processor family, at the Consumer Electronics Show in January. Some of the devices have been shipping since early January and Intel expects them to be incorporated into more than 500 laptop and desktop PC designs this year.

Minimize power consumption
Because Sandy Bridges' x86 cores and L3 cache share the same power plane, Intel faced the challenge that the minimum voltage needed to keep the L3 cache data may have limited the minimum operating voltage of the cores, increasing the power consumption of the system, according to the paper. Intel got around this issue by developing several circuit and logic design techniques to minimize the minimum operational voltage of the L3 cache and the register files of the chip to bring it to a lower level than the core logic, according to the paper.
"One of the design targets was to minimize as much as possible power consumption," Knoll stated.
One of the techniques used to skirt the issue was a shared p-channel MOSFET technique that weakens the memory cell pull up device effective strength that solves the problem of RF write-ability degradation at low voltages that can be created by manufacturing process variations, Knoll said.
Sandy Bridge's power dissipation ranges from 95W for a four-core device operating in a high-end desktop to17W for a two-core Sandy Bridge running an optimized mobile product, according to the paper.
Sandy Bridge also introduces a debug bus that allows monitoring the traffic between the x86 cores, GPU, caches and system agent on the processor internal ring. The bus, dubbed the Generic Debug eXternal Connection (GDXC), allows chip, system or software debuggers to sample ring data traffic as well as ring protocol control signals and drive it to an external logic analyzer, where it can be recovered and analyzed, according to the paper.
Sandy Bridge also includes two different types of thermal sensors to monitor the temperature of the die, according to the paper. One is a diode-based thermal sensor on each core that compares the diode voltage to output the temperature, providing information for throttling, catastrophic function and fan regulation. The second is a much smaller CMOS-based thermal sensor with a more limited temperature range that can be placed at several locations inside the core to provide an accurate picture of core hot spots, according to the paper.
Earlier this year, Intel discovered a design flaw in one of the support chips for the first quad-core version of Sandy Bridge that began shipping January 9. The company came up with a quick fix for the issue and temporarily halted shipments of the support chip. Intel later resumed shipments of the flawed chip to PC suppliers that were implementing it in systems where the flaw would not be an issue.

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Automotive IC Market Set to Grow 12% in 2011
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New car shipments, increased on-board electronics to boost automotive IC sales
The rapid motorization of China and other emerging markets along with recovery in the U.S. automotive market, coupled with growing demand for on-board electronics, will help propel the automotive IC market up 12% in 2011, to $17.2 billion. This follows a 45% increase in automotive IC sales in 2010 (Figure 1), which halted a two-year slide in the automotive IC market.
According to the 2011 edition of IC Insights' IC Market Drivers report, global shipments of new cars are expected to rise almost 5% in 2011 to 55.8 million units. The U.S. auto market is emerging from its recessionary downturn. Meanwhile, sales of new cars in China outpaced new car shipments in the U.S. by 50% in 2010--a trend that is expected to continue through mid-decade!
 
Figure 1
Automobiles are a fertile environment to implement new and innovative electronic systems and ICs. Many of these systems are competitive selling points for automakers. Growth drivers for ICs over the next several years include active safety and telematics systems, communications and entertainment convergence, and "green" initiatives such as energy savings and reduced emissions. These technologies are increasingly available as standard equipment on new cars across all price ranges.
In the area of safety and telematics, systems such as self parking, active cruise control, lane departure warning systems, and electronic stability control--ESC, have been widely implemented in Japan and Europe. Some of these systems will soon be required for all new cars sold in the U.S. An ESC system typically consists of three sensors--a gyroscope, an accelerometer, and a pressure sensor--all of which can be made using a microelectromechanical system (MEMS) process.
Highlighting the move to convergence, automakers are testing systems that will allow smartphones to dock with a large display on the car's center console allowing the driver to access the Internet, listen to his or her stored music, and send text messages through a large, onboard touchscreen rather than using the phone itself, and essentially replacing radio/CD/nav systems on cars sold today.
Shipments of electric and hybrid vehicles, which only a few years ago were counted on to boost automotive IC sales, are not expected to be a significant contributor to the automotive IC market in the immediate future. In fact, relatively stable gasoline prices led to a decline in hybrid vehicles sales in 2010. Shipments of hybrid and electric vehicles are forecast to increase a modest 8% in 2011.
Through 2014, the automotive IC market is forecast to grow to $20.9 billion, representing an average annual increase of 14.5% per year from 2009 to 2014. That growth rate tops the IC growth rate in all other system markets including computer (11.7%), communications (8.1%), and consumer (10.6%) systems, and the total worldwide IC market (10.6%) over the same time period.
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智慧型手機當道 新手機五哥呼之欲出
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paua

智慧型手機風潮不僅已席捲全球,更讓手機製造商排名也跟著大風吹。根據Gartner最新研究顯示,受惠於2010年智慧型手機產品銷售量大增,蘋果(Apple)與RIM首度躋身全球前五大手機品牌製造商之列,並分別站上第四及第五名位置,取代原本摩托羅拉(Motorola)和索尼愛立信(SonyEricsson)的地位。
Gartner指出,挾著積極的預付費用行銷策略及黑莓機(BlackBerry)郵件服務的穩定成長,RIM的手機銷售量自2009年的三千四百多萬支增長至2010年的四千七百四十五萬支,年增率高達38.2%,尤其2010年第四季在東南亞和歐洲市場,成長更為強勁。而蘋果則因擴大海外銷售市場,在2010年創下較2009年成長87.2%的銷售佳績,達四千六百六十萬支規模。因此,雙雙超越摩托羅拉和索尼愛立信的銷售表現,順利進入全球前五大手機製造商排行榜。
至於諾基亞(Nokia)、三星(Samsung)和樂金(LG)目前雖仍穩居前三名寶座,但在其他手機製造商爭相分食智慧型手機市場的衝擊下,2010年三家公司的整體市場占有率均呈現下滑局面,因此,除三星和樂金已快速調整產品研發方向,藉Android平台力拓智慧型手機江山外,諾基亞亦於2月11日宣布與微軟(Microsoft)結盟,將以更積極的策略強化智慧型手機市場戰力,鞏固手機龍頭寶座的位子。Gartner認為,諾基亞市占率下滑原因,不單是因為高階智慧型手機產品的發展牛步,合法白牌手機的快速蓬勃亦帶來不小的衝擊。而該公司如何在有限時間內,發揮與微軟間最大的合作綜效,將是其未來發展的關鍵課題。
顯而易見的,值此手機產品發展典範轉移之際,無疑是後起之秀大展身手的絕佳時機。現階段,RIM與蘋果雖暫時擠下摩托羅拉和索尼愛立信,名列新手機五哥榜單之列,但在手機銷售量和市占率表現均與第三名的樂金有著明顯的差距,加上宏達電機海戰術攻勢凌厲,摩托羅拉、索尼愛立信也已急起直追,因此,2011年第四、五名的手機製造商寶座爭奪戰,勢必競爭激烈。
整體而言,2010年全球手機銷售量達十六億支,較2009年增長31.8%,其中,智慧型手機占整體銷售比重達19%,約三億支規模,比2009年大幅成長72.1%。
 

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四核心開戰 高通/德儀/ST-Ericsson紛出招
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paua

行動裝置處理器戰火已快速蔓延至四核心戰場,包括高通(Qualocmm)、德州儀器(TI)與ST-Ericsson等首批授權安謀國際(ARM)Cortex-A15核心的處理器業者,紛紛在本屆全球行動通訊大會(MWC)上推出四核心處理器方案,為下一代智慧型手機與平板裝置(Tablet Device)提供媲美桌上型電腦的強大效能。  
高通行動運算暨消費性產品部資深副總裁Luis Pineda表示,該公司新一代Snapdragon處理器—APQ8064,整合無線區域網路(Wi-Fi)聯網功能,並可與高通3G及長程演進計畫(LTE)模組無縫連接,提供合作夥伴具彈性、成本效益且可快速上市的平台,滿足次世代平板裝置行動運算與消費性電子裝置設計的需求。  
這款採用28奈米製程技術所製造的Snapdragon處理器,係以代號「Krait」的新微架構為基礎,並整合四個低耗電的新中央處理器(CPU)與高階Adreno繪圖處理器(GPU),擁有高達2.5GHz的時脈速度,可提供較第一代Snapdragon快十二倍的處理效能,同時節省75%的耗電量。此外,還可支援近距離通訊(NFC)及立體三維(3D)影像擷取與重播等多項功能。預計將於2012年初開始提供晶片樣本。  
而德州儀器也不遑多讓,同樣也利用28奈米製程技術開發出最新一代OMAP 5應用處理器,不僅較前一代OMAP 4產品提升三倍的處理效能及五倍的3D繪圖效果,平均功耗也大幅減少60%。此外,OMAP 5平台的軟體具有極佳的重複使用特性,因此開發人員可從OMAP 4平台直接進行移轉。  
德州儀器OMAP平台事業部副總裁Remi El-Ouazzane指出,未來10年行動運算將興起革新風潮,行動裝置將持續整合各種功能,成為符合所有運算、娛樂以及每日複雜需求與興趣的單一裝置,而OMAP 5平台將成為實現此一遠景的重要關鍵。德州儀器預計於2011年下半年開始提供OMAP 5樣品,產品裝置則將於2012年下半年問世。  
至於ST-Ericsson亦在本屆行動通訊大會上推出多款新的Nova應用處理器系列、Thor先進數據機(Modem)系列及NovaThor高整合智慧型手機平台解決方案。值得注意的是,Nova A9600應用處理器雖僅整合兩顆ARM Cortex-A15 MPCore核心,但其每顆核心的行動運算效能已可達2.5GHz,比現今的U8500平台提升兩倍之多,預計將於今年底揭露。
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Tablets: Much Bigger Than You Think, Says Morgan Stanley
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A “blue paper” is what Morgan Stanley calls its 96-page report today on the prospects for tablet computing, authored by numerous analysts, including Kathryn Huberty, Mark Lipacis, Adam Holt and Ehud Gelblum.
The big picture: people don’t appreciate how big tablet computing can get, write the authors. They project shipments of more than 100 million by 2012. (To put that in perspective, analysts have been projecting Apple may ship between 30 and 40 million units of its iPad this year, and the entire industry may ship 50 million, according to several published estimates.)
The team did multiple surveys that they say canvassed 8,000 consumers and 50 corporate CIOs. The findings show, they write, that tablets are set to be taken up by two thirds of corporations in 2011, either through direct purchase or allowing employees to take up the machines personally within the firewall. And the writers were “surprised,” they note, by what the data said about International demand: “While consensus views the tablet market as largely a U.S. consumer phenomenon, the international consumer survey data surprised us.”
Demand in major developed economies, phrased in the survey as “extreme interest in purchasing a tablet in the next 12 months, was higher than in the U.S., with only 11% of U.S. respondents surveyed saying yes, but 15% in France, 16% in Japan, 18% in Germany, 20% in the U.K., and a whopping 41% in China. And the overall international demand was 21%.
And while only 20% of tablet owners use the machines for content creation (as opposed to viewing, listening, etc.), below 56% on laptops, the authors “believe the rate of introduction of new mobile applications and faster processors could increase these figures over time.”
The best-positioned companies in this are the dominant tablet companies or the arms merchants: Apple, ARM Holdings, Broadcom, Samsung, and SanDisk.
The worst-positioned, in the view of Morgan Stanley’s team, are Advanced Micro Devices, Dell , Lexmark, and Ricoh. And that bears a little explaining: Leaving aside AMD and Dell, Morgan Stanley believes tablets will actually help push users more toward the “paperless office,” and so they write that cannibalization of printing supplies is a much-understated potential area for cannibalization, and that that could hurt Ricoh and Lexmark.


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Tablet forecast bad news for netbooks
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ricasso
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2011 looks to be the real year of the tablet

Nearly 56 million tablets are expected to be produced in 2011. A new report from DisplaySearch uses information and trends from the display manufacturing industry to forecast an increase of more than 200 percent over 2010 tablet shipments.
Getting Apple, Samsung, Motorola or other tablet vendors to spill figures on expected sales is like pulling teeth in most cases - and understandably so. Announcing that you expect to sell 10 million, and then only selling one million can be rather humiliating. But, if the vendor never makes any upfront prediction, one million can be heralded as a victory.
Behind the scenes, though, the vendor still has to have some ball park numbers in mind. It has to be able to manage the logistics of manufacturing and shipping however many tablets it expects to sell, which begins with ordering enough parts to make them in the first place. With a little sleuthing, paying attention to backend suppliers can provide enlightening details about what the industry has in store. That is how DisplaySearch is able to weigh in on the growth of the tablet market.
"The upcoming product announcements, introductions and demonstrations in the coming weeks will build on the tremendous momentum that the market has already seen and will lead to segmentation in the tablet (slate) PC market," said Richard Shim, mobile computing analyst for DisplaySearch. "This segmentation translates to significant shipment growth and proliferation in the short and long term."
DisplaySearch expects that 7in and 10in tablets will continue to dominate the tablet size options. In order to deliver a 16:9 or 16:10 aspect ratio, some tablet vendors will adopt 10in widescreen displays.
DisplaySearch also suggests that the explosion of the tablet market will cannibalize the netbook and low-end notebook markets. Intel may be inadvertently fanning those flames with the recent glitch with the Sandy Bridge chipset. As the variety of tablets grows, and the functions and capabilities of those tablets expand, the continue to encroach on the realm of netbooks and notebooks.
Some analysts have projected that Apple alone plans to produce nearly 50 million iPads in 2011. If true, that would mean that Apple alone would account for nearly 86 percent of the total tablets predicted by DisplaySearch. Either the Apple estimate is wildly high, rival tablets have very timid production plans, or the DisplaySearch figure is on the low end.
Suffice it to say that all signs indicate that 2011 will truly be the year of the tablet, and possibly the beginning of the end for netbooks.
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ecosystem
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