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華為手機晶片打美國政府耳光 – 路透社
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胡卜凱

這篇報導也可以用《禁運之徒勞無功》為標題。請參見《「中國突然間面臨崩潰」之胡說八道(該文第1-5) -- 美國制裁)


Teardown of Huawei's new phone shows China's chip breakthrough

, 09/05/23

(Reuters) - Huawei Technologies and China's top chipmaker SMIC (中芯國際) have built an advanced 7-nanometer processor to power its latest smartphone, according to a teardown report by analysis firm TechInsights.

Huawei's Mate 60 Pro is powered by a new Kirin 9000s chip that was made in China by Semiconductor Manufacturing International Corp (SMIC), TechInsights said in the report shared with Reuters on Monday.

Huawei started selling its Mate 60 Pro phone last week. The specifications provided advertised its ability to make satellite calls, but offered no information on the power of the chipset inside.

The processor is the first to utilize SMIC's most advanced 7nm technology and suggests the Chinese government is making some headway in attempts to build a domestic chip ecosystem, the research firm said.

The firm's findings were first reported by Bloomberg News.

Huawei and SMIC did not immediately reply to Reuters' request for comment.

Buyers of the phone in China have been posting tear-down videos and sharing speed tests on social media that suggest the Mate 60 Pro is capable of download speeds exceeding those of top line 5G phones.

The phone's launch sent Chinese social media users and state media into a frenzy, with some noting it coincided with a visit by U.S. Commerce Secretary Gina Raimondo.

From 2019, the U.S. has restricted Huawei's access to chipmaking tools essential for producing the most advanced handset models, with the company only able to launch limited batches of 5G models using stockpiled chips.

But research firms told Reuters in July that they believed Huawei was planning a return to the 5G smartphone industry by the end of this year, using its own advances in semiconductor design tools along with chipmaking from SMIC.

Dan Hutcheson, an analyst with TechInsights, told Reuters the development comes as a "slap in the face" to the U.S.

"Raimondo comes seeking to cool things down, and this chip is [saying] 'look what we can do, we don't need you,'" he said.

(Reporting by Shivani Tanna in Bengaluru and Max A.; Editing by Sandra Maler Cherney in San Francisco; Editing by Shilpi Majumdar)


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胡卜凱

我對半導體技術和產業都不熟悉就不假扮專家說些廢話了。請至原網頁參看所附照片。

China Does It Again

TechInsights, 10/26/23

A NAND Memory Market First

TechInsights has discovered the world's most advanced 3D NAND memory chip in a consumer device, and in a surprise technology leap, it comes from 
YMTC – China’s top 3D NAND manufacturer. 3D NAND memory is an essential component for high-performance computing (HPC) such as artificial intelligence (AI) and machine-learning. 3D NAND memory represents the bleeding edge of memory chip design, and is critical for high-performance, high-bandwidth computing such as AI. This is the first quad-level cell (QLC) 3D NAND die with more than two hundred active word lines that TechInsights has seen.

The 232-layer QLC 3D NAND die manufactured by YMTC (Figure 1), was found in the ZhiTai Ti600 1TB solid state drive (SSD) which was launched in July 2023 without much fanfare (Figure 2 and Figure 3). This new QLC die has the highest bit density seen in a commercially available NAND product at 19.8 Gb/mm2.

Key takeaways from this discovery include:

* YMTC proved again the merits of the Xtacking Hybrid Bonding technology they developed for 3D NAND TLC and QLC applications. BSSC technology adopted for Xtacking3.0 232L realized yield and performance improvements, and cost reduction as well.
* YMTC is quietly developing advanced technology despite being hampered by issues following sanctions including limiting the company from supplying parts to Apple for China-based iPhones and being placed on the United States’ entity list.
* The recent memory downturn, as well as many memory manufacturers focused on cost saving measures, may have provided YMTC an opportunity to pull ahead with its higher bit density 3D Xtacking NAND.
* This discovery usurps Micron and Intel (Solidigm) who are also developing 232-layer QLC 3D NAND devices. It should be noted that Samsung is not developing QLC on its 236-layer (V8) 3D NAND because its current strategy is to focus on the V9 3D NAND TLC and QLC. However, at Samsung’s Memory Tech Day last week, the company announced the first QLC product targeting the mobile market, a 512GB UFS 3.1 product with 176-layers (V7) technology. SK Hynix is mostly focused on TLC devices rather than QLC products.
* Like the innovation revealed by TechInsights in the Huawei Mate 60 Pro’s HiSilicon Kirin 9000s processor (which used SMIC 7nm (N+2) process) evidence is mounting that China’s momentum to overcome trade restrictions and build its own domestic semiconductor supply chain is more successful than expected.



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